Copper clad plate ----- also known as the base material. The reinforcing material is dipped in resin and covered with copper foil on one or both sides by hot pressing of a tabular material, known as copper clad laminate. It is the basic material of PCB, often called base material. When used in multilayer production, it is also called CORE.

Copper Clad Laminate (Copper Clad Laminate, full name Copper Clad Laminate, English abbreviation CCL), is made of wood pulp paper or glass fiber cloth as reinforcement material, impregnated with resin, single or double sided covered with Copper foil, by hot pressing a product, Copper Clad Laminate is the basic material of electronic industry, mainly used for processing and manufacturing printed circuit board (PCB), Widely used in TV sets, radios, computers, computers, mobile communications and other electronic products.

Copper clad plate has a history of nearly 100 years, which is an inseparable development history of technology with the synchronous development of electronic information industry, especially PCB industry. The development of copper clad plates began in the early 20th century. At that time, the manufacture of resin, reinforcement material and substrate for copper cladding had made gratifying progress, such as:

In 1909, The United States Dr. Bakeland (Bakeland) on the development and application of phenolic resin.

In 1934, Schlack in Germany synthesized epoxy resin from bisphenol A and epichlorohydrin.

1938, American Owens. Corning Fiberglass began to produce fiberglass.

In 1939, The American Anaconda company pioneered the electrolysis of copper foil production technology.

The development of the above technology has laid an important foundation and created the necessary conditions for the development of copper clad plate. Since then, with the invention and application of integrated circuit, the miniaturization and high performance of electronic products, promoted the further development of coppers technology and production.

Buildup Multilayer technology is developing rapidly while a variety of new Buildup materials, including resin coated copper foil (RCC), have emerged.